<Sub board>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
F1A
S1
A
GEA10284A
2
D624
created date:2010-02-09
No.MA467
(No.MA467<Rev.001>)14/21