(No.MB366)1-13
3.1.7 Removing the power amplifier ICs
(See Figs.14 to 16)
• Remove the metal cover, rear panel and amplifier board.
(1) From the forward side of the amplifier board, remove the
four screws
H
and screw
J
attaching the power amplifier
ICs to the heat sink. (See Figs.14 and 15.)
(2) From the reverse side of the amplifier board, remove the
three screws
K
attaching the heat sink. (See Fig.16.)
(3) Remove the soldered sections (
g
,
h
,
j
) and remove the
power amplifier ICs from the forward side of the amplifier
board. (See Fig.16.)
Fig.14
Fig.15
Fig.16
Amplifier board
H
Heat sink
Power amplifier IC (AIC01)
Amplifier board
H
J
Heat sink
Power amplifier IC (PIC021)
Power amplifier IC (AIC02)
Amplifier board
K
g
j
h
Summary of Contents for CA-HXC6
Page 7: ... No MB366 1 7 Fig 3 Metal cover A A ...
Page 35: ...3 13 MEMO ...
Page 41: ...2 2 Block diagram ...
Page 44: ...2 5 CD section ...
Page 45: ...2 6 Front section ...
Page 50: ... M E M O ...