iWave iW-RainboW-G21M, Hardware User'S Manual

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REL1.1
Page 82 of 92
RZ/G1H Qseven SOM Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
3.2 Environmental Characteristics
3.2.1 Environmental Specification
The below table provides the Environment specification of RZ/G1H Qseven SOM.
Table 18: Environmental Specification
Parameters Min Max
Operating temperature range
1,2,3
-40°C 85°C
Humidity – Operating
4
- 95%RH
¹ iWave guarantees the component selection for the given operating temperature. The operating temperature at the
system level will be affected by the various system components like carrier board and its components, system enclosure,
air circulation in the system, system power supply etc. Based on the system design, specific heat dissipating approach
might be required from system to system. It is recommended to do the necessary system level thermal simulation and
find necessary thermal solution in the system before using this board in the end application.
² If Expansion connectors are supported in RZ/G1H Qseven SOM, operating temperature range is -35°C to 85°C. If HDMI
Transmitter feature is supported in RZ/G1H Qseven SOM, operating temperature range is 0°C to 70°C.
3
For more information on Thermal solution & Heat Sink/Spreader, refer the following section.
4
To meet this humidity specification, conformal coating needs to be done on the board. By default, iWave boards
doesn’t come with conformal coating. Please contact iWave to support conformal coating.
3.2.2 Heat Sink/Spreader
For any highly integrated System On Modules, ther mal design is very important factor. As IC’s size is decreasing and
performance of module is increasing by rising processor frequencies, it generates high amount of heat which should
be dissipated for the system to work as expected without fault.
To dissipate the heat, appropriate thermal management technique like Heat spreader, Heat sink must be used. Always
remember that, if you use more effective thermal solution, you will get more performance out of the CPU.
Heat spreader acts as thermal coupling device between Module and external thermal solution. Heat spreader also
provides thermal coupling to CPU via gap filler for better heat exchange. Heat spreader is not a complete thermal
solution by itself. Heat spreader has to be used with application specific thermal solutions like heat sinks, Chassis, fans,
Heat pipes etc.
iWave supports Heat Sink & Heat Spreader Solution for RZ/G1H Qseven SOM. Please refer the below figures for Heat
Sink & Heat Spreader dimension details. For ordering information, refer section 4 ORDERING INFORMATION .