IGEP
TM
v2
Hardware Reference Manual
ISEE 2007 S.L. All rights reserved, IGEP
™
is a registered trademar k from ISEE 2007 S.L. The followi ng is provided for informational purpos es onl y.
DOCUMENT FROM ISEE 2007 S.L. Ref: MAN-PR-IGEP0020-RCx
16
5.3
OMAP PROCESSOR
IGEP
™
v2 BOARD uses OMAP3530 (version ES3.1) or DM3730 as core processor and comes in a
0.4mm pitch memory POP package on it.
POP (Package on Package) is a technique where the memory, NAND and SDRAM, are mounted
on top of the OMAP3530 or DM3730. For this reason, when looking at the IGEP
™
v2 BOARD,
you will not find an actual part labeled OMAP3530 or DM3730.
Figure 7 POP Package
For accurate information on this processor, revise OMAP DATA MANUAL official document
from Texas Instruments official site
5.4
MEMORY
The memory is mounted on top of the processor as mentioned. The key function of the POP
memory is to provide:
4Gb (Giga Bits) NAND x 16 (512 Mega Bytes)
4Gb (Giga Bits) LP-DDR SDRAM x32 (512 Mega Bytes @ 200MHz)
5.5
POWER MANAGEMENT
The TPS65950 is used to provide power to the IGEP
™
v2 Board with the exception of the 3.3V
regulator which is used to provide power to the DVI-D encoder and RS232 driver. In addition to
the power it also provides:
Stereo Line Audio Out
Stereo Line Audio in
Power on reset
USB OTG PHY
Status LED
