— APIS FUZZ (2021-06-30)
BUILD STEPS
1. SOLDER PASSIVE COMPONENTS
Solder all components onto the PCB, starting with the lowest-profile ones, i.e. resistors
and diodes — excluding the LED. The painted bands on the diodes need to line up with
the bands on the PCB.
Continue with the capacitors. It’s important that they sit flush on the board, there isn’t
much clearance in the 1590A enclosure.
Electrolytic capacitors are polarised, which means they have a specific orientation.
Make sure that the negative terminal of the capacitor is in the correct pad. Film and
ceramic capacitors have no polarisation and can be installed in any orientation.
2. SOLDER ACTIVE COMPONENTS
Solder the transistors and the photofet. These components are very sensitive, apply heat
only for a very short time. Consider letting them cool down after each lead is soldered.
These devices are also sensitive to electrostatic discharge (ESD), take care.
Make sure the TLP222G photofet is properly oriented. The point on the photofet must be
aligned with the point of its footprint on the PCB.
Push the 2N2222 metal can transistors down firmly, but gently. They must not touch the
PCB and should not be taller than the film capacitors.
Summary of Contents for APIS FUZZ
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