IRDC3863
Stencil Design
The Stencil apertures for the lead lands should be approximately
80% of the area of the lead lads. Reducing the
amount of solder deposited will minimize the occurrences of lead
shorts. If too much solder is deposited on the
center pad, the part will float and the lead lands will open.
The maximum length and width of the land pad stencil aperture should be equal to the solder resist opening minus
an annular 0.2mm pull back in order to decrease the risk of shorting the center land to the lead lands when the part
is pushed into the solder paste.
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