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33
RD-0617
IRAUDAMP4 PCB Specifications
Figure 34. Motherboard and Daughter Board Layer Stack
Motherboard:
Material:
FR4, UL 125
°
C
Layer stack:
2 layers, 1 oz. Cu
Dimensions:
5.2 in x 5.8 in x 0.062 in
Solder mask:
LPI solder mask, SMOBC on top and bottom layers
Plating:
Open copper solder finish
Silkscreen:
On top and bottom layers
Daughter board:
Material:
FR4, UL 125
°
C
Layer stack:
2 Layers, 1 oz. Cu each, through-hole plated
Dimensions:
3.125 in x 1.52 in x 0.062 in
Solder mask:
LPI solder mask, SMOBC on top and bottom layers
Plating:
Open copper solder finish
Silkscreen:
On top and bottom layers
Summary of Contents for IRAUDAMP4
Page 35: ...www irf com 34 RD 0617 IRAUDAMP4 PCB Layers Motherboard Figure 35 Top Layer and Pads...
Page 36: ...www irf com 35 RD 0617 Figure 36 Top Side Solder Mask and Silkscreen 4 0...
Page 37: ...www irf com 36 RD 0617 Figure 37 Bottom Layer and Pads...
Page 38: ...www irf com 37 RD 0617 Figure 38 Bottom Side Solder Mask and Silkscreen...
Page 42: ...www irf com 41 RD 0617 Figure 44 Bottom Side of Motherboard Showing Component Locations...
