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T h e r m a l I s o l a t i n g ( T I )
The TI thermal isolating pad uses a 0.006” (0.15mm) special film which
has high thermal conductivity (0.9 W/m-K) and high dielectric strength
(5000 Cps). The TI thermal insulating pad can withstand high voltages
and does not require thermal grease to transfer heat. The following pads
are available for the IB series drivers:
TI-462 ............................................................................................... IB462
TI-463 ............................................................................................... IB463
TI-100 .............................................................. IB104, IB106 & IB1010