Mechanical
Rev: 001
19
3.2
Cover Glass
The
Intel® RealSense™ ID Solution
F450 module components must be covered to
minimize impact of dust and humidity. The transparent cover glass material stack-up
must provide acceptable transmission based on the component wavelengths. The
through hole sizes of the cover glass is dependent on the optical component field of
view or field of illumination as well as the cone diameter from the optical component
to the cover glass.
A 3D CAD assessment should be completed to ensure no collision between the cone
part of each optical component and the cover glass opening.
Table 3-3: Transmissivity Requirement
THROUGH HOLE
TRANSMISSIVITY
1, 2, 3 and 4
>98% @ 400nm to 865nm
Figure 3-2: Through Hole Design
3.3
Optical Isolation
It is recommended to isolate the cameras from the illumination components to
prevent reflections off the cover material. Not properly isolating the cameras can
result in leakage light from the illumination components. It is recommended to use a
gasket material in between the cover glass and the
Intel® RealSense™ ID Solution
F450 module. The gasket material needs to be compliant so that it does not transmit
chassis flex forces to the module.
Summary of Contents for RealSense ID Solution F450
Page 7: ...Rev 001 7 Revision History Revision Description Date 001 Initial Public Release January 2021...
Page 9: ...Overview Rev 001 9 Figure 1 2 Intel RealSense ID Solution F450 Module Host System Topology...
Page 37: ...Appendix A Interposer Reference Designs Rev 001 37 Figure 8 2 UART Interposer Reference Design...
