Introduction
R
Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide
9
1.2
Definition of Terms
Term Definition
BGA
Ball Grid Array. A package type defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical
interface is an array of solder balls attached to the substrate opposite the die and
molding compound.
Intel
®
ICH3-S /
Intel
®
ICH4
I/O Controller Hub. The chipset component that contains the primary PCI interface,
LPC interface, USB, ATA-33, and other legacy functions.
MBGA
Mini Ball Grid Array. A version of the BGA with a smaller ball pitch.
MCH
Memory Controller Hub. The chipset component that contains the processor interface
and the memory interface.
FC-BGA
Flip Chip Ball Grid Array. A package type defined by a resin-fiber substrate where a die
is mounted using an underfilled C4 (Controlled Collapse Chipset Connection) attach
style. The primary electrical interface is an array of solder balls attached to the
substrate opposite the die. The device arrives at the customer with solder balls
attached. This is the packaging technology used for the MCH.
Intel
®
P64H2
Bus Controller Hub. The chipset component that interfaces the PCI-X buses.
T
case
Maximum die temperature allows. This temperature is measured at the geometric
center of the top of the package die.
TDP
Thermal Design Power. Thermal solutions should be designed to dissipate this target
power level.
