Reference Thermal Solutions
R
Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide
21
6
Reference Thermal Solutions
Intel has developed a reference thermal solution designed to meet the cooling needs of the
E7500/E7505 chipset MCH at worst-case conditions. This chapter describes the overall
requirements for the reference thermal solution, including critical-to-function dimensions,
operating environment, and validation criteria. Other chipset components may or may not need
thermal solutions, depending on specific system local-ambient operating conditions. For
information on the P64H2 thermal solutions, refer to the
Intel
®
82870P2 PCI-64 Hub 2 (P64H2)
Thermal Design Guidelines
. For the ICH3-S, refer to thermal specification in the
Intel
®
82801CA
I/O Controller Hub 3 (ICH3-S) Datasheet
. For the ICH4, refer to thermal specification in the
Intel
®
82801DB I/O Controller Hub 4 (ICH4) Datasheet
.
6.1 Operating
Environment
The reference thermal solution was designed assuming a maximum local-ambient temperature of
50
°
C. The minimum recommended airflow velocity at the heatsink is 200 lfm (linear feet per
minute). The approaching airflow temperature is assumed to be equal to the local-ambient
temperature. The thermal designer must carefully select the location to measure airflow to obtain
an accurate estimate. These local-ambient conditions are based on a 35
°
C external-ambient
temperature at sea level. (External-ambient refers to the environment external to the system.)
6.2
Mechanical Design Envelope
Though each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed on the
E7500/E7505 chipset MCH thermal solution are shown in Figure 7.
When using heatsinks that extend beyond the MCH reference heatsink envelope shown in
Figure 7, any motherboard components placed between the heatsink and motherboard cannot
exceed 2.286 mm (0.090 in.) in height.
