Case Temperature Reference Metrology
94
Thermal and Mechanical Design Guidelines
14.
Using a fine point device, place a small amount of flux on the thermocouple bead.
Be careful not to move the thermocouple bead during this step (Figure 7-24).
Ensure the flux remains in the bead area only.
Figure 7-24. Applying Flux to the Thermocouple Bead
15.
Cut two small pieces of solder 1/16 inch (0.065 inch / 1.5 mm) from the roll using
tweezers to hold the solder while cutting with a fine blade (Figure 7-25).
Figure 7-25. Cutting Solder
Summary of Contents for CELERON PROCESSOR E3000 - THERMAL AND MECHANICAL DESIGN
Page 24: ...Processor Thermal Mechanical Information 24 Thermal and Mechanical Design Guidelines ...
Page 80: ...Heatsink Clip Load Metrology 80 Thermal and Mechanical Design Guidelines ...
Page 82: ...Thermal Interface Management 82 Thermal and Mechanical Design Guidelines ...
Page 108: ...Fan Performance for Reference Design 108 Thermal and Mechanical Design Guidelines ...