Intel Celeron D, Thermal Design Manual

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Intel
®
Celeron
®
D Processor in the 775-Land LGA Package Thermal Design Guide
Order #303730
Intel Enabled Thermal Solutions
maximum T
LA
, acoustic requirements, etc.) to meet the processor’s thermal requirements. The
entire thermal solution, from heatsink design, chassis configuration, and airflow source, must be
optimized for server systems to obtain the best performing solution.
Intel has worked with a third-party vendor to enable a heatsink design for the Celeron D Processor
in the 775-land LGA package for the 1U form factor. This design was optimized for the 1U form
factor within the available volume for the thermal solution. The motherboard component keep-ins
are shown in
Figure 37, “1U/2U Motherboard Component Keep-In Definition, Primary Side” on
page 62 and Figure 38, “1U/2U Motherboard Component Keep-In Definition, Secondary Side” on
page 63 .
This solution requires 100 percent of the airflow to be ducted through the heatsink fins to prevent
heatsink bypass. A copper base and copper fin heatsink are attached to the motherboard with the
use of a backplate. This solution is shown in
Figure 9 .
Based on preliminary testing, this heatsink has shown to have a performance (
Ψ
CA
) of 0.325 °C/W
with 18 CFM of airflow. This will allow a maximum T
LA
of 40 °C and meet the processors
Thermal Profile specification as described in the processor datasheet. This heatsink solution uses
the Honeywell* PCM45F as the Thermal Interface Material (TIM). The performance of the
heatsink could improve with more airflow, however the final intended thermal solution including,
heatsink, airflow source, TIM, and attach mechanism must be validated by system integrators.
Developers of thermal solutions for the Intel Celeron D Processor in the 775-Land LGA Package
must ensure that the solution meets the processor thermal specifications as stated in the processor
datasheet and follow the recommended motherboard component keep-out as shown in
Figure 37
and Figure 38 . This keep-out will ensure that the processor thermal solution will not interfere with
the voltage regulator components. In addition to this, a thermal solution design must meet the
maximum component heights as specified by the 1U
Thin Electronics Bay Specifications located at
http://www.ssiforum.org . Figure 10 illustrates the z-height constraints of the 1U form factor as
outlined in the specification.
Figure 9. 1U Copper Heatsink