Product Description
31
1.7
Audio Subsystem
The onboard audio subsystem consists of the following:
•
Intel 82801GB ICH7
•
Analog Devices ADI1988A (or Sigmatel STAC9227) audio codec
•
Back panel audio connectors
•
Component-side audio headers
The audio subsystem supports the following features:
•
Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. Within hardware
constraints, the back panel audio jacks are capable of retasking according to the
user’s definition, or can be automatically switched depending on the recognized
device type.
•
Stereo input and output for all back panel jacks
•
Line out and Mic in functions for front panel audio jacks
•
A signal-to-noise (S/N) ratio of 95 dB
•
SLIC Voice over IP (VoIP) support using the High Definition Audio link header
Figure 7 is a block diagram of the audio subsystem.
82801GB
I/O
Controller
Hub
(ICH7)
OM18389
Intel
High Definition
Audio Link
Audio
Codec
Line Out/Retasking Jack
Mic In
Line In/Retasking Jack
Mic In/Retasking Jack
Line Out
Back
Panel
Front
Panel
High Definition
Audio Link
Connector
Figure 7. 6-Channel (5.1) Audio Subsystem Block Diagram