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Intel
®
RAID Maintenance Free Backup Unit AXXRMFBU2
User’s Guide
Disclaimer
Information in this document is provided in connection with Intel
®
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Intel
®
’s Terms and Conditions of Sale for such products, Intel
®
assumes no liability whatsoever, and Intel
®
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®
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or other intellectual property right. Intel
®
products are not designed, intended or authorized for use in any
medical, life saving, or life sustaining applications or for any other application in which the failure of the Intel
®
product could create a situation where personal injury or death may occur. Intel may make changes to
specifications and product descriptions at any time, without notice.
Intel
®
server boards contain a number of high-density VLSI and power delivery components that need
adequate airflow for cooling. Intel’s own chassis are designed and tested to meet the intended thermal
requirements of these components when the fully integrated system is used together. It is the responsibility of
the system integrator that chooses not to use Intel developed server building blocks to consult vendor
datasheets and operating parameters to determine the amount of airflow required for their specific application
and environmental conditions. Intel Corporation can not be held responsible if components fail or the server
board does not operate correctly when used outside any of their published operating or non-operating limits.
Intel, Intel Pentium, and Intel Xeon are trademarks or registered trademarks of Intel Corporation or its
subsidiaries in the United States and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2012 Intel Corporation. All Rights Reserved.
Copyright © 2007 - 2012 LSI* Corporation. All Rights Reserved.
