80960MC
iii
1.0 THE i960
®
MC PROCESSOR ................................................................................................................. .. 1
1.1 Key Performance Features ................................................................................................................. 2
1.1.1 Memory Space And Addressing Modes ................................................................................... 4
1.1.2 Data Types ............................................................................................................. .................. 4
1.1.3 Large Register Set ..................................................................................................... .............. 4
1.1.4 Multiple Register Sets .............................................................................................................. 5
1.1.5 Instruction Cache ..................................................................................................................... 5
1.1.6 Register Scoreboarding ................................................................................................. .......... 5
1.1.7 Memory Management and Protection ...................................................................................... 6
1.1.8 Floating-Point Arithmetic .............................................................................................. ............ 6
1.1.9 Multitasking Support ................................................................................................................ 7
1.1.10 Synchronization and Communication .................................................................................... 7
1.1.11 High Bandwidth Local Bus ..................................................................................................... 7
1.1.12 Multiple Processor Support .................................................................................................... 7
1.1.13 Interrupt Handling .................................................................................................... .............. 8
1.1.14 Debug Features ..................................................................................................................... 8
1.1.15 Fault Detection ....................................................................................................................... 8
1.1.16 Inter-Agent Communications (IAC) ...................................................................................... .. 9
1.1.17 Built-in Testability ................................................................................................................... 9
1.1.18 Compatibility with 80960K-Series ...................................................................................... .... 9
1.1.19 CHMOS ................................................................................................................. ................. 9
2.0 ELECTRICAL SPECIFICATIONS ................................................................................................ ........... 13
2.1 Power and Grounding ...................................................................................................... ................. 13
2.2 Power Decoupling Recommendations ......................................................................................... .... 13
2.3 Connection Recommendations ........................................................................................................ 13
2.4 Characteristic Curves ....................................................................................................................... 13
2.5 Test Load Circuit .............................................................................................................................. 16
2.7 DC Characteristics ....................................................................................................... ..................... 17
2.6 Absolute Maximum Ratings .............................................................................................................. 17
2.8 AC Specifications ............................................................................................................................. 18
2.9 Design Considerations ..................................................................................................................... 22
3.0 MECHANICAL DATA .............................................................................................................................. 22
3.1 Packaging ......................................................................................................................................... 22
3.1.1 Pin Assignment ...................................................................................................................... 22
3.2 Pinout ............................................................................................................................................... 26
3.3 Package Thermal Specification ........................................................................................................ 28
4.0 WAVEFORMS ......................................................................................................................................... 30
5.0 REVISION HISTORY ............................................................................................................................... 35
