R
Intel
®
6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
9
2 Packaging
Technology
The Intel
®
6700PXH 64-bit PCI Hub component uses a 31 mm x 31 mm, 8-layer FC-BGA package
(see Figure 2-1Figure 2-1Figure 2-1, Figure 2-2Figure 2-2Figure 2-2, and Figure 2-3Figure
2-3Figure 2-3).
Figure 2-1. Intel
®
6700PXH 64-bit PCI Hub Package Dimensions (Top View)
31.00 mm
31.00 mm
Die
Keepout
Area
0.491 in.
Handling
Exclusion
Area
PXH
Die
0.547 in. 0.247 in.
0.291 in.
21.00 mm
17.00 mm
21.00 mm
17.00 mm
0.200 in.
Figure 2-2. Intel
®
6700PXH 64-bit PCI Hub Package Dimensions (Side View)
0.20
–C–
Die
Substrate
0.435 ± 0.025 mm
See Note 3
Seating Plane
2.010 ± 0.099 mm
See Note 1
Decoup
Cap
0.7 mm Max
2.445 ± 0.102 mm
0.84 ± 0.05 mm
0.20 See note 4.
Notes:
1.Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach).
2.All dimensions and tolerances conform to ANSI Y14.5M-1994.
3.BGA has a pre-SMT height of 0.5 mm and post-SMT height of 0.41-0.46 mm.
4.Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly
concave (bowl shaped) orientation after reflow.
