R
Intel
®
6700PXH 64-bit PCI Hub Thermal/Mechanical Design Guidelines
7
1 Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to improve
heat dissipation include selective use of ducting, and/or passive heatsinks.
The goals of this document are to:
•
Outline the thermal and Mechanical operating limits and specifications for the Intel
®
6700PXH 64-bit PCI Hub component.
•
Describe a reference thermal solution that meets the specification of Intel
®
6700PXH 64-bit
PCI Hub component.
Properly designed thermal solution provides adequate cooling to maintain the PXH component die
temperatures at or below thermal specifications. This is accomplished by providing a low local-
ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient
thermal resistance. By maintaining the PXH component die temperature at or below the specified
limits, a system designer can ensure the proper functionality, performance, and reliability of the
chipset. Operation outside the functional limits can degrade system performance and may cause
permanent changes in the operating characteristics of the component.
The simplest and most cost effective method to improve the inherent system cooling characteristics
is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is
required, component thermal solutions may be implemented in conjunction with system thermal
solutions. The size of the fan or heatsink can be varied to balance size and space constraints with
acoustic noise.
This document addresses thermal design and specifications for the Intel
®
6700PXH 64-bit PCI Hub
components only. For thermal design information on other chipset components, refer to the
respective component datasheet.
Unless otherwise specified, the term “PXH” refers to the Intel
®
6700PXH 64-bit PCI Hub.
1.1
Definition of Terms
BGA
Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical
interface is an array of solder balls attached to the substrate opposite the die and molding
compound.
BLT
Bond line thickness. Final settled thickness of the thermal interface material after
installation of heatsink.
MCH
Memory controller hub. The chipset component that contains the processor interface, the
memory interface, and the hub interface.
PXH Intel
®
6700PXH 64-bit PCI Hub. The chipset component that performs PCI bridging
functions between the PCI Express* interface and the PCI Bus. It contains two PCI bus
interfaces that can be independently configured to operate in PCI (33 or 66 MHz) or
PCI-X mode 1 (66, 100, or 133 MHz), for either 32 or 64 bit PCI devices.
