Preliminary Datasheet
7 of 32
002-29368 Rev. *C
2021-08-02
r e s t r i c t e d
Rapid IoT Connect System on Module
Dual band Wi-Fi and Bluetooth®
System connections
Recommended host PCB layout
provides details that can be used for the recommended host PCB layout pattern for CYSBSYS-RP01.
Dimensions are in millimeters unless otherwise noted. Pad length of 1.02 mm as shown in
is the
minimum recommended host pad length. All dimensions are referenced to the center of the solder pad.
To maximize performance, the host layout should follow these recommendations:
• The ideal placement of the CYSBSYS-RP01 board is in a corner of the host board with the antenna located outside
the edge of the host board. This placement minimizes the additional recommended keep out area stated in
item 3.
• To maximize RF performance, the area immediately around the system antenna should contain a keep out area,
where no grounding or signal traces are contained. This keep out area applies to all layers of the host board.
The recommended dimensions of the host PCB keep out area are shown in
.
• If fanout of traces are done under the board, care should be taken to fill the used area under the board with
copper plane to avoid any unbalanced surface that may lead to an assembly issue.
• No metal should be located beneath or above the antenna area. Only bare PCB material should be located
beneath the antenna area.
Figure 4
Board land pattern on host PCB (Top view seen on host PCB)
Host Land Pattern (View from Top)
Recommended Host PCB Keep Out Area
Pad dimensions
1.
20
0.40
Land Pattern
Solder Mask
Solder Paste
Don t put any metal objects or batteries (if applicable)
above or below the yellow region.
Keep away any other metals from clearance area,
including ground plane
Flush the antenna side PCB edge to host PCB edge
for optimal performance
0.80
14
.3
8
24.13
3.66
2.53
5.06
ANTENNA
AREA
2.53
1.
2
0
1.
2
0
1
0.50
0.60
1.
3
0
15
.2
0
27.79
A
N
TE
NNA
A
R
EA
1.53
1.53
20.80
12
.8
0
13
.1
8
8.0
0
