Infineon CYSBSYS-RP01 Manual Download

Page: 29 / 32

Preliminary Datasheet

29 of 32

002-29368 Rev. *C

2021-08-02

r e s t r i c t e d

Rapid IoT Connect System on Module

Dual band Wi-Fi and Bluetooth®

Acronyms

Acronyms

Table 18

Acronyms used in this document

Acronym

Description

ADC

analog-to-digital converter

CM4

Cortex

-M4, an Arm

CPU

CMOS

complementary metal-oxide-semiconductor, a process technology for IC fabrication

CSD

CAPSENSE

Sigma-Delta

CSX

Cypress mutual capacitance sensing method

ECO

external crystal oscillator

EEPROM

electrically erasable programmable read-only memory

EMI

electromagnetic interference

ESD

electrostatic discharge

GPIO

general-purpose input and output, applies to a PSoC

GND

Ground

IoT

Internet of Things

MCU

microcontroller unit

RAM

random-access memory

ROM

read-only memory

RTC

real-time clock

WCO

watch crystal oscillator

Summary of Contents for CYSBSYS-RP01

Page 1: ...d passive components CYSBSYS RP01 provides up to 51 I Os in a 26 59 x 14 0 x 2 5 mm castellated surface mount PCB for easy manufacturing CYSBSYS RP01 is the fastest way to deploy a secure and reliable network of IoT devices Features Dual core PSoC microcontroller 150 MHz Arm Cortex M4F 100 MHz Cortex M0 2048 KB Application flash 1024 KB SRAM Wi Fi and Bluetooth 5 0 combo radio Dual band 2 4 and 5 ...

Page 2: ... Electrical specifications 17 Absolute maximum ratings 17 Recommended operating conditions 18 DC specifications 18 GPIO DC specifications 18 External ECO specification 18 RF parameters 19 Wi Fi radio 19 Bluetooth and Bluetooth LE 19 Power consumption 20 2 4 GHz WLAN current consumption 20 5 GHz WLAN current consumption 20 Bluetooth and Bluetooth LE current consumption 20 Environmental specificatio...

Page 3: ...iminary Datasheet 3 of 32 002 29368 Rev C 2021 08 02 re str i cte d Rapid IoT Connect System on Module Dual band Wi Fi and Bluetooth Table of contents Acronyms 29 Document conventions 30 Revision history 31 ...

Page 4: ...s a certified system for customers to design their end solutions There are five major subsystems PSoC 6 MCU Single chip ultra low power IEEE 802 11n compliant IEEE 802 11ac friendly Wi Fi with Integrated Bluetooth 5 0 radio Crystal and oscillators Chip antenna for Wi Fi and Bluetooth CAPSENSE external modulation and integration capacitors and other passives like bypass capacitors and limiting resi...

Page 5: ...em has an on board 32 768 kHz oscillator shared between PSoC 6 MCU and the radio The 32 768 kHz oscillator is used by PSoC 6 MCU for the WCO block for Deep sleep operation for low power mode timing Chip antenna for Wi Fi and Bluetooth The system has an ultra miniature chip antenna that supports 5 GHz and 2 4 GHz bands The selected antenna has an efficiency of up to 51 at 2 4 GHz at 48 for 5 GHz Se...

Page 6: ...s capacitor parasitic should be simulated to design and obtain optimal bypassing All capacitors should be 20 X5R ceramic or better Power supplies and ports correspond as follows P0 VBACKUP P5 P6 P7 P8 VDDIO1 P9 P10 VDDA P11 P12 P13 VDDIO0 P14 VDDUSB External reset XRES CYSBSYS RP01 has an integrated power on reset circuit which completely resets all circuits to a known power on state This action c...

Page 7: ...where no grounding or signal traces are contained This keep out area applies to all layers of the host board The recommended dimensions of the host PCB keep out area are shown in Figure 4 If fanout of traces are done under the board care should be taken to fill the used area under the board with copper plane to avoid any unbalanced surface that may lead to an assembly issue No metal should be loca...

Page 8: ..._3 9 P11_5 10 P11_4 11 P11_6 12 P11_2 13 P11_1 14 GND 15 P5_5 16 P6_0 17 P6_1 18 P5_4 19 P5_1 U1 U2 U3 L1 Y2 GND GND GND GND GND P0_4 USBDM P10_3 P6_4 P10_4 P6_5 P10_5 P6_6 P10_6 P6_7 P10_7 P10_2 USBDP P10_1 P11_0 VDDUSB VDDIO0 VDDIO1 VBACKUP VDDD GND GND VDDA XRES_L GND GND VBAT_WL VBAT_WL GND GND GND P11_7 P12_7 P10_0 P11_6 P12_6 P11_5 P11_4 P11_3 P11_2 P8_4 P11_1 P8_3 P8_2 P0_5 P5_7 P8_1 P5_6 P...

Page 9: ... VBAT_WL 23 VBAT_WL 24 GND 25 VDDIO_WL 26 P5_7 27 P5_3 28 P5_6 29 P8_4 30 P8_0 31 P8_3 32 P8_2 33 P8_1 34 P7_3 35 P0_4 36 P0_5 37 GND 38 P6_3 39 P6_2 40 P11_0 41 P10_0 42 P10_1 43 P10_2 44 P10_3 45 P10_4 46 P10_7 47 P10_5 48 P10_6 49 XRES_L 50 VDDD 51 GND 52 USBDP 53 USBDM 54 VDDUSB 55 VDDIO0 56 VBACKUP 57 P12_7 58 P12_6 59 GND Table 1 Pin information Pad number Pad name ...

Page 10: ... 72 P7_0 73 GND Table 1 Pin information Pad number Pad name MCU IOs U1B CYSBSYS RP01 P0_4 35 P0_5 36 P5_0 20 P5_1 19 P5_2 21 P5_3 27 P5_4 18 P5_5 15 P5_6 28 P5_7 26 P6_0 16 P6_1 17 P6_4 68 P6_5 70 P6_6 71 P6_7 69 P7_0 72 P9_0 63 P9_1 66 P9_2 60 P9_3 64 P9_4 62 P9_7 61 P12_6 58 P12_7 57 XRES_L 49 P10_0 41 P10_1 42 P10_2 43 P10_3 44 P10_4 45 P10_5 47 P10_6 48 P10_7 46 P6_3 38 P6_2 39 P11_0 40 P11_1 ...

Page 11: ...d csd_ tx_n 30 scb 5 u art_rx 0 scb 5 i2c_scl 0 scb 5 spi _mosi 0 audios s 0 clk _i2s_if 0 peri tr _io_in put 10 0 P5 1 tcpwm 0 line_ compl 4 0 tcpwm 1 line_ compl 4 0 csd cs d_tx 3 1 csd csd_ tx_n 31 scb 5 u art_tx 0 scb 5 i2c_sd a 0 scb 5 spi _miso 0 audios s 0 tx _sck 0 peri tr _io_in put 11 0 P5 2 tcpwm 0 line 5 0 tcpwm 1 line 5 0 csd cs d_tx 3 2 csd csd_ tx_n 32 scb 5 u art_rts 0 scb 5 spi _c...

Page 12: ...ne_ compl 9 0 csd cs d_tx 4 1 csd csd_ tx_n 41 scb 3 u art_cts 0 scb 3 spi _select0 0 scb 8 spi_ selec t0 0 P6 4 tcpwm 0 line 2 1 tcpwm 1 line 10 0 csd cs d_tx 4 2 csd csd_ tx_n 42 scb 8 i2c_s cl 1 scb 6 u art_rx 2 scb 6 i2c_scl 2 scb 6 spi _mosi 2 peri tr _io_in put 12 0 peri tr _io_ou tput 0 1 cpuss swj_s wo_td o scb 8 spi_ mosi 1 P6 5 tcpwm 0 line_ compl 2 1 tcpwm 1 line_ compl 10 0 csd cs d_tx...

Page 13: ...ompl 16 0 csd cs d_tx 5 5 csd csd_ tx_n 55 scb 4 u art_tx 0 scb 4 i2c_sd a 0 scb 4 spi _miso 0 peri tr _io_in put 17 0 P8 2 tcpwm 0 line 1 2 tcpwm 1 line 17 0 csd cs d_tx 5 6 csd csd_ tx_n 56 lpcom p dsi_ comp 0 0 scb 4 u art_rts 0 scb 4 spi _clk 0 P8 3 tcpwm 0 line_ compl 1 2 tcpwm 1 line_ compl 17 0 csd cs d_tx 5 7 csd csd_ tx_n 57 lpcom p dsi_ comp 1 0 scb 4 u art_cts 0 scb 4 spi _select0 0 P8 ...

Page 14: ... 5 csd csd_ tx_n 65 scb 2 u art_cts 0 scb 2 spi _select0 0 audios s 0 tx _sdo 1 cpus s tra ce_d ata 0 0 P9 4 tcpwm 0 line 7 5 tcpwm 1 line 0 2 csd cs d_tx 6 6 csd csd_ tx_n 66 scb 2 spi _select1 0 audios s 0 rx _sck 1 P9 7 tcpwm 0 line_ compl 0 6 tcpwm 1 line_ compl 1 2 csd cs d_tx 6 9 csd csd_ tx_n 69 P10 0 tcpwm 0 line 6 2 tcpwm 1 line 22 0 csd cs d_tx 7 0 csd csd_ tx_n 70 scb 1 u art_rx 1 scb 1...

Page 15: ... 1 line_ compl 0 1 csd cs d_tx 7 5 csd csd_ tx_n 75 scb 1 spi _select2 1 audio ss 0 pdm_ data 0 P10 6 tcpwm 0 line 1 6 tcpwm 1 line 2 2 csd cs d_tx 7 6 csd csd_ tx_n 76 scb 1 spi _select3 1 P10 7 tcpwm 0 line_ compl 1 6 tcpwm 1 line_ compl 2 2 csd cs d_tx 7 7 csd csd_ tx_n 77 P11 0 tcpwm 0 line 1 3 tcpwm 1 line 1 1 csd cs d_tx 7 8 csd csd_ tx_n 78 smif s pi_se lect2 scb 5 u art_rx 1 scb 5 i2c_scl ...

Page 16: ...d cs d_tx 8 2 csd csd_ tx_n 82 smif s pi_dat a2 scb 5 spi _select1 1 audios s 1 rx _sck 1 peri tr _io_ou tput 1 0 P11 5 tcpwm 0 line_ compl 3 3 tcpwm 1 line_ compl 3 1 csd cs d_tx 8 3 csd csd_ tx_n 83 smif s pi_dat a1 scb 5 spi _select2 1 audios s 1 rx _ws 1 P11 6 csd cs d_tx 8 4 csd csd_ tx_n 84 smif s pi_dat a0 scb 5 spi _select3 1 audios s 1 rx _sdi 1 P11 7 smif s pi_clk P12 6 tcpwm 0 line 7 3 ...

Page 17: ...the device may not operate to specification Table 2 Absolute maximum ratings Parameter Description Min Max Units VBAT_WL DC supply voltage for dual band 802 11ac friendly radio with Bluetooth 5 0 VBAT and PA driver supply 0 5 5 0 V VDDIO_WL DC supply voltage for digital I O 0 5 2 20 V VDDD VBACKUP VDDIO0 Internal regulator and Port 1 GPIO supply for PSoC 6 MCU Backup power and GPIO Port 0 supply w...

Page 18: ...V VDDD and VDDIO0 must be to VDDIO_WL Min VBACKUP is 1 4 V in Backup Mode VDDA VDDIO1 Analog power supply voltage for PSoC 6 MCU GPIO supply for ports 5 to 8 when present 1 8 3 3 3 3 V VDDIO_1 must be to VDDA VDDUSB Supply for Port 14 USB or GPIO when present 1 8 3 3 3 3 V Min supply is 2 85 V for USB Table 4 GPIO DC specifications Parameter Description Min Max Units Details conditions VIH Input v...

Page 19: ...ver Sensitivity 11a 6 Mbps 92 dBm 11a 54 Mbps 75 dBm 11n HT20 MCS0 92 dBm 11n HT20 MCS7 76 dBm 11n HT20 MCS8 71 dBm Table 7 5 GHz parameters Parameter Condition Min Typ Max Unit Operating Frequency range 2400 2500 MHz Transmit Power 11n MCS7 16 17 5 18 dBm 11b DSSS 17 18 18 7 dBm Receiver Sensitivity 11b 1 Mbps 97 dBm 11b 11 Mbps 89 dBm 11g 6 Mbps 94 dBm 11g 54 Mbps 77 dBm 11n HT20 MCS0 94 dBm 11n...

Page 20: ...AT_WL mA VDDIO_WL mA VDDD mA VDDA mA Continuous RX MCS7 HT20 1SS 1 1 1 1 Active TX modes VBAT_WL mA VDDIO_WL mA VDDD mA VDDA mA Continuous TX MCS7 HT20 1SS 1 1 1 1 Table 10 5 GHz WLAN current consumption Mode VBAT_WL 3 6V VDDIO_WL VDDD VDDIO0 1 8V VDDIO1 VDDA VDD_USB 3 3V TA 25 C Sleep modes VBAT_WL μA VDDIO_WL μA VDDD μA VDDA μA Radio OFF 1 1 1 1 Sleep Current 1 1 1 1 Active RX modes VBAT_WL mA V...

Page 21: ...1 is certified under the following RF certification standards CE FCC ID ISED Environmental conditions This section describes the operating and storage conditions for CYSBSYS RP01 ESD and EMI protection Exposed components require special attention to ESD and EMI Device handling Proper ESD protocol must be followed in manufacturing to ensure component reliability Table 12 Environmental conditions fo...

Page 22: ...m that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help LABELING REQUIREMENTS The Original Equipment Manufacturer OEM must ensure that FCC labeling requirements are met This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cypress Semiconductor FCC identifier for this product as well as the FCC Notic...

Page 23: ...epter toute interférence reçue y compris les interférences pouvant entraîner un fonctionnement indésirable ISED INTERFERENCE STATEMENT FOR CANADA This device complies with Innovation Science and Economic Development ISED Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference i...

Page 24: ...t provisions of Directive 2014 As a result of the conformity assessment procedure described in Annex III of the Directive 2014 the end customer equipment should be labeled as follows All versions of the CYSBSYS RP01 in the specified reference design can be used in the following countries Austria Belgium Cyprus Czech Republic Denmark Estonia Finland France Germany Greece Hungary Ireland Italy Latvi...

Page 25: ...Figure 9 details the orientation of CYSBSYS RP01 in the tape as well as the direction for unreeling Figure 8 Tape dimensions Table 13 Solder reflow peak temperature Part number Package Maximum peak temperature Maximum time at peak temperature No of cycles CYSBSYS RP01 73 pin castellated solder pads 260 C 30 seconds 2 Table 14 Package moisture sensitivity level MSL IPC JEDEC J STD 2 Part number Pac...

Page 26: ...ckaging Figure 10 details reel dimensions used for CYSBSYS RP01 Figure 9 Tape dimensions CYSBSYS RP01 is designed to be used with pick and place equipment in an SMT manufacturing environment Figure 10 shows the center of mass for CYSBSYS RP01 Figure 10 Center of mass for CYSBSYS RP01 Preliminary version 12mm 7mm 12mm 7mm Preliminary version ...

Page 27: ...wn in Figure 11 and Table 15 Figure 11 Board dimensions Top side and bottom views Table 15 Board dimensions Mark Dimension Unit L Typical 26 59 mm W Typical 14 mm PCB thickness 1 0 mm RF shield height 1 5 mm T Total system thickness max 2 5 mm 14 00 1 00 1 50 Top View View from Top Side View Bottom View View from Top 23 53 ANTENNA AREA Pad dimension 1 1 00 26 59 0 50 0 40 0 80 1 93 5 06 1 93 1 14 ...

Page 28: ...les representative or visit our website www cypress com Table 16 Ordering information Part number Package Features Antenna CYSBSYS RP01 73 pin castellated solder pads Chip antenna Table 17 Tape and reel package quantity and minimum order amount Description Minimum reel quantity Maximum reel quantity Comments Reel quantity 400 400 Ships in 500 unit reel quantities Minimum order quantity MOQ 400 Ord...

Page 29: ...l oxide semiconductor a process technology for IC fabrication CSD CAPSENSE Sigma Delta CSX Cypress mutual capacitance sensing method ECO external crystal oscillator EEPROM electrically erasable programmable read only memory EMI electromagnetic interference ESD electrostatic discharge GPIO general purpose input and output applies to a PSoC pin GND Ground IoT Internet of Things MCU microcontroller u...

Page 30: ...ntions Document conventions Table 19 Unit of measure Symbol Unit of measure C degrees Celsius dB decibel dBm decibel milliwatts Hz hertz KB 1024 bytes kbps kilobits per second kHz kilohertz Mbps megabits per second MHz megahertz MΩ mega ohm µF microfarad µW microwatt mA milliampere nA nanoampere Ω ohm pF picofarad ppm parts per million s second V volt ...

Page 31: ... 32 002 29368 Rev C 2021 08 02 re str i cte d Rapid IoT Connect System on Module Dual band Wi Fi and Bluetooth Revision history Revision history Document version Date of release Description of changes C 2021 08 02 Initial release ...

Page 32: ...ct of Infineon Technologies in customer s applications The data contained in this document is exclusively intended for technically trained staff It is the responsibility of customer s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application For further inform...

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