Infineon Cypress EZ-BLE CYBLE-012011-00 Manual Download Page 23

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Document Number: 002-02521 Rev. *G

Page 22 of 39

CYBLE-012011-00

Serial Communication

Table 28. Fixed I

C DC Specifications

Table 30. Fixed UART DC Specifications

Table 31. Fixed UART AC Specifications

Parameter

Description

Min

Typ

Max

Units

Details/Conditions

I2C1

Block current consumption at 100 kHz

–

µA

–

I2C2

Block current consumption at 400 kHz

–

155

µA

–

I2C3

Block current consumption at 1 Mbps

–

390

µA

–

I2C4

C enabled in Deep-Sleep mode

–

1.4

µA

–

Table 29. Fixed I

C AC Specifications

Parameter

Description

Min

Typ

Max

Units

Details/Conditions

I2C1

Bit rate

–

400

kHz

Parameter

Description

Min

Typ

Max

Units

Details/Conditions

UART1

Block current consumption at 100 kbps

–

µA

–

UART2

Block current consumption at 1000 kbps

–

312

µA

–

Parameter

Description

Min

Typ

Max

Units

Details/Conditions

UART

Bit rate

–

Mbps

–

Table 32. Fixed SPI DC Specifications

Parameter

Description

Min

Typ

Max

Units

Details/Conditions

SPI1

Block current consumption at 1 Mbps

–

360

µA

–

SPI2

Block current consumption at 4 Mbps

–

560

µA

–

SPI3

Block current consumption at 8 Mbps

–

600

µA

–

Table 33. Fixed SPI AC Specifications

Parameter

Description

Min

Typ

Max

Units

Details/Conditions

SPI

SPI operating frequency (master; 6x

over sampling)

–

MHz

–

Table 34. Fixed SPI Master Mode AC Specifications

Parameter

Description

Min

Typ

Max

Units

Details/Conditions

DMO

MOSI valid after SCLK driving edge

–

DSI

MISO valid before SCLK capturing edge

Full clock, late MISO sampling used

–

Full clock, late MISO sampling

HMO

Previous MOSI data hold time

–

Referred to Slave capturing edge

Table 35. Fixed SPI Slave Mode AC Specifications

Parameter

Description

Min

Typ

Max

Units

Details/Conditions

DMI

MOSI valid before SCLK capturing edge

–

DSO

MISO valid after SCLK driving edge

–

42 + 3 ×

CPU

DSO_ext

MISO Valid after SCLK driving edge in

external clock mode. V

< 3.0 V

–

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Summary of Contents for Cypress EZ-BLE CYBLE-012011-00

Page 1: ...f the Infineon product portfolio Continuity of document content The fact that Infineon offers the following product as part of the Infineon product portfolio does not lead to any changes to this document Future revisions will occur when appropriate and any changes will be set out on the document history page Continuity of ordering part numbers Infineon continues to support existing part numbers Pl...

Page 2: ...nsumption TX output power 18 dbm to 3 dbm Received signal strength indicator RSSI with 1 dB resolution TX current consumption of 15 6 mA radio only 0 dbm RX current consumption of 16 4 mA radio only Low power mode support Deep Sleep 1 3 µA with watch crystal oscillator WCO on Hibernate 150 nA with SRAM retention Stop 60 nA with GPIO P2 2 or XRES wakeup Functional Capabilities Up to 22 capacitive s...

Page 3: ...ronment IDE that enables concurrent hardware and firmware editing compiling and debugging of PSoC 3 PSoC 4 PSoC 5LP PSoC 4 BLE and EZ BLE module systems with no code size limitations PSoC peripherals are designed using schematic capture and simple graphical user interface GUI with over 120 pre verified production ready PSoC Components PSoC Components are analog and digital virtual chips represente...

Page 4: ... System Resources 24 Environmental Specifications 29 Environmental Compliance 29 RF Certification 29 Safety Certification 29 Environmental Conditions 29 ESD and EMI Protection 29 Regulatory Information 30 FCC 30 ISED 31 European R TTE Declaration of Conformity 31 MIC Japan 32 KC Korea 32 Packaging 33 Ordering Information 35 Part Numbering Convention 35 Acronyms 36 Document Conventions 36 Units of ...

Page 5: ... dimensions shown in the mechanical drawings in Figure 1 All dimensions are in millimeters mm Table 1 Module Design Dimensions See Figure 1 on page 5 for the mechanical reference drawing for CYBLE 012011 00 Dimension Item Specification Module dimensions Length X 14 52 0 15 mm Width Y 19 20 0 15 mm Antenna location dimensions Length X 11 00 0 15 mm Width Y 5 00 0 15 mm PCB thickness Height H 0 80 0...

Page 6: ...beneath or above the antenna area Only bare PCB material should be located beneath the antenna area For more information on recommended host PCB layout see Figure 3 Figure 4 Figure 5 and Figure 6 and Table 3 Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com ...

Page 7: ...m 2 Refer to AN96841 for module placement best practices 2 To maximize RF performance the area immediately around the Cypress BLE module trace antenna should contain an additional keep out area where no grounding or signal trace are contained The keep out area applies to all layers of the host board The recommended dimensions of the host PCB keep out area are shown in Figure 3 dimensions are in mm...

Page 8: ...ure 6 is the minimum recommended host pad length The host PCB layout pattern can be completed using either Figure 4 Figure 5 or Figure 6 It is not necessary to use all figures to complete the host PCB layout pattern Figure 4 Host Layout Pattern for CYBLE 012011 00 Figure 5 Module Pad Location from Origin Top View Seen on Host PCB Top View Seen on Host PCB Downloaded from Arrow com Downloaded from ...

Page 9: ... 39 16 31 15 35 642 13 11 0 39 17 58 15 35 692 13 12 2 04 18 82 80 31 740 94 13 3 31 18 82 130 31 740 94 14 4 58 18 82 180 31 740 94 15 5 85 18 82 230 31 740 94 16 7 12 18 82 280 31 740 94 17 8 39 18 82 330 31 740 94 18 9 66 18 82 380 31 740 94 19 10 93 18 82 430 31 740 94 20 12 20 18 82 480 31 740 94 21 13 47 18 82 530 31 740 94 22 14 14 16 31 556 69 642 12 23 14 14 15 04 556 69 592 12 24 14 14 1...

Page 10: ... TCPWM Sensor 23 P0 7 SCB0_CTS SCB0_SCLK TCPWM Sensor SWDCLK 24 P0 6 SCB0_RTS SCB0_SS0 TCPWM Sensor SWDIO 25 GND 5 Ground Connection 26 GND 5 Ground Connection 27 GND 5 Ground Connection 28 GND 5 Ground Connection 29 VDDR Radio Power Supply 1 9V to 5 5V 30 P5 0 SCB1_RX SCB1_SS0 SCB1_SDA TCPWM3_P Sensor 31 P5 1 SCB1_TX SCB1_SCLK SCB1_SCL TCPWM3_N Sensor Notes 2 TCPWM Timer Counter and Pulse Width M...

Page 11: ...y External Component Recommendation In either connection scenario it is recommended to place an external ferrite bead between the supply and the module connection The ferrite bead should be positioned as close as possible to the module pin connection Figure 7 details the recommended host schematic options for a single supply scenario The use of one or two ferrite beads will depend on the specific ...

Page 12: ...wer Supply Option Seen from Bottom Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com ...

Page 13: ...c Diagram Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com ...

Page 14: ...ion Silicon U1 56 pin QFN PSoC 4 BLE Crystal Y1 24 000 MHz 12PF Crystal Y2 32 768 kHz 12 5PF Item Description Frequency Range 2400 2500 MHz Peak Gain 0 5 dBi typical Average Gain 0 5 dBi typical Return Loss 10 dB minimum Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow c...

Page 15: ...n current for latch up 200 200 mA Parameter Description Min Typ Max Units Details Conditions RFO RF output power on ANT 18 0 3 dBm Configurable via register settings RXS RF receive sensitivity on ANT 87 dBm Guaranteed by design simulation FR Module frequency range 2400 2480 MHz GP Peak gain 0 5 dBi GAvg Average gain 0 5 dBi RL Return loss 10 5 dB Table 9 CYBLE 012011 00 DC Specifications Parameter...

Page 16: ...nd reset active nA T 40 C to 85 C Hibernate Mode VDD 3 6 V to 5 5 V IDD29 GPIO and reset active nA T 25 C VDD 5 V IDD30 GPIO and reset active nA T 40 C to 85 C Stop Mode VDD 1 8 V to 3 6 V IDD33 Stop mode current VDD 20 nA T 25 C VDD 3 3 V IDD34 Stop mode current VDDR 40 nA T 25 C VDDR 3 3 V IDD35 Stop mode current VDD nA T 40 C to 85 C IDD36 Stop mode current VDDR nA T 40 C to 85 C VDDR 1 9 V to ...

Page 17: ... IOH 1 mA at 1 8 V VDD VOL Output voltage LOW level 0 6 V IOL 8 mA at 3 3 V VDD Output voltage LOW level 0 6 V IOL 4 mA at 1 8 V VDD Output voltage LOW level 0 4 V IOL 3 mA at 3 3 V VDD RPULLUP Pull up resistor 3 5 5 6 8 5 k RPULLDOWN Pull down resistor 3 5 5 6 8 5 k IIL Input leakage current absolute value 2 nA 25 C VDD 3 3 V IIL_CTBM Input leakage on CTBm input pins 4 nA CIN Input capacitance 7 ...

Page 18: ...ion Min Typ Max Units Details Conditions TRISE_OVFS Output rise time in Fast Strong mode 1 5 12 ns 25 pF load 10 90 VDD 3 3 V TFALL_OVFS Output fall time in Fast Strong mode 1 5 12 ns 25 pF load 10 90 VDD 3 3 V TRISESS Output rise time in Slow Strong mode 10 60 ns 25 pF load 10 90 VDD 3 3 V TFALLSS Output fall time in Slow Strong mode 10 60 ns 25 pF load 10 90 VDD 3 3 V FGPIOUT1 GPIO FOUT 3 3 V VD...

Page 19: ...VREF A_ISAR Current consumption 1 mA A_VINS Input voltage range single ended VSS VDDA V A_VIND Input voltage range differential VSS VDDA V A_INRES Input resistance 2 2 k A_INCAP Input capacitance 10 pF VREFSAR Trimmed internal reference to SAR 1 1 Percentage of Vbg 1 024 V Table 19 SAR ADC AC Specifications Parameter Description Min Typ Max Units Details Conditions A_PSRR Power supply rejection ra...

Page 20: ... for 7 bit resolution 1 1 LSB IDAC2 INL for 7 bit resolution 3 3 LSB SNR Ratio of counts of finger to noise 5 Ratio Capacitance range of 9 pF to 35 pF 0 1 pF sensitivity Radio is not operating during the scan IDAC1_CRT1 Output current of IDAC1 8 bits in High range 612 µA IDAC1_CRT2 Output current of IDAC1 8 bits in Low range 306 µA IDAC2_CRT1 Output current of IDAC2 7 bits in High range 305 µA IDA...

Page 21: ...MHz 42 µA 16 bit counter ICTR2 Block current consumption at 12 MHz 130 µA 16 bit counter ICTR3 Block current consumption at 48 MHz 535 µA 16 bit counter Table 23 Counter AC Specifications Parameter Description Min Typ Max Units Details Conditions TCTRFREQ Operating frequency FCLK 48 MHz TCTRPWINT Capture pulse width internal 2 TCLK ns TCTRPWEXT Capture pulse width external 2 TCLK ns TCTRES Counter...

Page 22: ...Parameter Description Min Typ Max Units Details Conditions ILCDLOW Operating current in low power mode 17 5 µA 16 4 small segment display at 50 Hz CLCDCAP LCD capacitance per segment common driver 500 5000 pF LCDOFFSET Long term segment offset 20 mV ILCDOP1 LCD system operating current VBIAS 5 V 2 mA 32 4 segments 50 Hz at 25 C ILCDOP2 LCD system operating current VBIAS 3 3 V 2 mA 32 4 segments 50...

Page 23: ...Typ Max Units Details Conditions FSPI SPI operating frequency master 6x over sampling 8 MHz Table 34 Fixed SPI Master Mode AC Specifications Parameter Description Min Typ Max Units Details Conditions TDMO MOSI valid after SCLK driving edge 18 ns TDSI MISO valid before SCLK capturing edge Full clock late MISO sampling used 20 ns Full clock late MISO sampling THMO Previous MOSI data hold time 0 ns R...

Page 24: ...onds FEND Flash endurance 100 K cycles FRET Flash retention TA 55 C 100 K P E cycles 20 years FRET2 Flash retention TA 85 C 10 K P E cycles 10 years Note 9 It can take as much as 20 ms to write to flash During this time the device should not be reset or flash operations will be interrupted and cannot be relied on to have completed Reset sources include the XRES pin software resets CPU lockup state...

Page 25: ... LVI_A D_SEL 3 0 0011b 1 95 2 00 2 05 V VLVI5 LVI_A D_SEL 3 0 0100b 2 05 2 10 2 15 V VLVI6 LVI_A D_SEL 3 0 0101b 2 15 2 20 2 26 V VLVI7 LVI_A D_SEL 3 0 0110b 2 24 2 30 2 36 V VLVI8 LVI_A D_SEL 3 0 0111b 2 34 2 40 2 46 V VLVI9 LVI_A D_SEL 3 0 1000b 2 44 2 50 2 56 V VLVI10 LVI_A D_SEL 3 0 1001b 2 54 2 60 2 67 V VLVI11 LVI_A D_SEL 3 0 1010b 2 63 2 70 2 77 V VLVI12 LVI_A D_SEL 3 0 1011b 2 73 2 80 2 87...

Page 26: ...requency variation from 3 to 48 MHz 2 With API called calibration FIMOTOL3 IMO startup time 12 µs Table 47 ILO DC Specifications Parameter Description Min Typ Max Units Details Conditions IILO2 ILO operating current at 32 kHz 0 3 1 05 µA Table 48 ILO AC Specifications Parameter Description Min Typ Max Units Details Conditions TSTARTILO1 ILO startup time 2 ms FILOTRIM1 32 kHz trimmed frequency 15 3...

Page 27: ... 30 dB RF PHY Specification RCV LE CA 03 C OBB1 Out of band blocking Wanted signal at 67 dBm and Interferer at F 30 2000 MHz 30 27 dBm RF PHY Specification RCV LE CA 04 C OBB2 Out of band blocking Wanted signal at 67 dBm and Interferer at F 2003 2399 MHz 35 27 dBm RF PHY Specification RCV LE CA 04 C OBB3 Out of band blocking Wanted signal at 67 dBm and Interferer at F 2484 2997 MHz 35 27 dBm RF PH...

Page 28: ... TXSE2 Transmitter spurious emissions average 1 0 GHz 41 5 dBm FCC 15 247 RF Current Specifications IRX Receive current in normal mode 18 7 mA IRX_RF Radio receive current in normal mode 16 4 mA Measured at VDDR IRX HIGHGAIN Receive current in high gain mode 21 5 mA ITX 3dBm TX current at 3 dBm setting PA10 20 mA ITX 0dBm TX current at 0 dBm setting PA7 16 5 mA ITX_RF 0dBm Radio TX current at 0 dB...

Page 29: ... 5 dB RSSI RES RSSI resolution 1 dB RSSI PER RSSI sample period 6 µs Parameter Description Min Typ Max Units Details Conditions Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded f...

Page 30: ...protection and a low impedance path to ground Device Handling Proper ESD protocol must be followed in manufacturing to ensure component reliability Description Minimum Specification Maximum Specification Operating temperature 40 C 85 C Operating humidity relative non condensation 5 85 Thermal ramp rate 3 C minute Storage temperature 40 C 85 C Storage temperature and humidity 85 C at 85 ESD Module ...

Page 31: ...e FCC Notice above The FCC identifier is FCC ID WAP2011 In any case the end product must be labeled exterior with Contains FCC ID WAP2011 ANTENNA WARNING This device is tested with a standard SMA connector and with the antennas listed below When integrated in the OEMs product these fixed antennas require installation preventing end users from replacing them with non approved antennas Any antenna n...

Page 32: ... produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radioélectrique subi même si le brouillage est susceptible d en compromettre le fonctionnement LABELING REQUIREMENTS The Original Equipment Manufacturer OEM must ensure that ISED labelling requirements are met This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Cy...

Page 33: ...ded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from A...

Page 34: ...1 00 31 pad SMT MSL 3 Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded fro...

Page 35: ...aded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from ...

Page 36: ...kage Quantity and Minimum Order Amount Description Minimum Reel Quantity Maximum Reel Quantity Comments Reel Quantity 500 1 000 Reel quantity ships in either 500 unit or 1 000 unit reel quantities Minimum Order Quantity MOQ 500 Order Increment OI 500 U S Cypress Headquarters Address 198 Champion Court San Jose CA 95134 U S Cypress Headquarter Contact Info 408 943 2600 Cypress website address http ...

Page 37: ...egree Celsius kV kilovolt mA milliamperes mm millimeters mV millivolt µA microamperes µm micrometers MHz megahertz GHz gigahertz V volt Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Down...

Page 38: ...able 4 to add additional information with respect to the functional capabil ities for each solder pad C 5418690 DSO 08 30 2016 Updated General Description Updated Power Consumption Replaced Stop 60 nA with XRES wakeup with Stop 60 nA with GPIO P2 2 or XRES wakeup under Low power mode support Updated More Information Added Knowledge Base Article references Updated Electrical Specification Updated S...

Page 39: ...iption More Information Environmental Specifications Regulatory Information and Part Numbering Convention Updated Figure 6 Removed CYBLE 012012 10 part number Updated Sales page Document Title CYBLE 012011 00 EZ BLE Creator Module Document Number 002 02521 Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded from Arrow com Downloaded fr...

Page 40: ...igned or intended for the operation of weapons weapons systems nuclear installations life support devices or systems other medical devices or systems including resuscitation equipment and surgical implants pollution control or hazardous substances management or other uses where the failure of the device or system could cause personal injury death or property damage Unintended Uses A critical compo...

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