24
Hardware Installation and User’s Guide
Hardware Specifications and Features
•
SAF-TE intelligent enclosure support
•
Instant availability and background initialization
•
Automatic rebuild with private (dedicated) or pooled (global) hot fix (spare) drives
•
Variable data strip size configurable per array
•
32MB, 64MB, 128MB, and 256MB of ECC SDRAM support
•
Read/write controller and disk caching
•
Hot plug disk drive auto detection configurable for non-intelligent enclosures
•
Hot plug drive support
Table 3-1. Hardware Architecture
Component
Features
I/O Microprocessor
Intel 80303 processor 100MHz
Cache Memory
3.3V unbuffered PC133 ECC SDRAM (32MB, 64MB,
128MB, 256MB)
Flash Memory
3.3V, 16Mb (2MB) flash memory chip used to store the
RAID firmware
I/O interface (PCI)
PCI 2.2 compliant, universally keyed for 3.3V and 5V
PCI slots
PCI Transfer Rate
528 MB/sec (Burst) DMA to PCI and local buses
PCI Signaling
+5V or +3.3V
SCSI Controller
LSI* 53C1000* Single Channel Ultra160 SCSI controller
Dual Fibre Channel Controller
Two 2Gb Fibre Channel (FC) HSSDC external
connectors
Table 3-2. Environmental Specifications
Specification
Range or Dimension
Operating Temperature
0
°
C to +55
°
C
Storage Temperature
-40
°
C to +70
°
C
Form Factor (physical dimensions)
Height: 99 mm (3.90 inches)
Length: 237 mm (9.33 inches)
