IBM 9835-415, Deployment Manual

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perforated tiles immediately in front of the rack (see Figure 13).
3.
Cut a 200
×
200 mm (8
×
8 in.) opening in the rear floor tile for under-floor
cabling and electricity (see Figure 13).
Notes:
v Place the opening under the FlashSystem A9000R system, centered on the back
edge of the tile along the rear of the rack.
v Sizing the cutout correctly is important. An oversized cutout permits excessive
cooling loss and weakens the floor tile. An undersized cutout must be enlarged,
which causes an installation delay while the tile is replaced or the cutout is
enlarged.
4.
To allow for ventilation for airflow and support system cooling requirements,
have at least two tiles (and preferably more) in front of the FlashSystem
A9000R system (see Figure 13). These tiles must have a minimum of 40%
perforation.
5. If the rear-door heat exchanger is ordered, see “Raised floor hose requirements
and management” on page 51 for additional floor preparation steps.
Preparing for non-raised-floor installation and cabling
Prepare the installation site to accommodate overhead cabling for mainline-power
cables, customer Fibre Channel (FC) and Ethernet host cables as well as network
Ethernet cables.
Using overhead cabling provides many of the cooling and safety benefits that are
provided by raised flooring in a non-raised floor environment.
Unlike raised-floor cabling, the installation planning, cable length, and the system
location in relation to the cable entry point are critical to the successful installation
of a top cable exit.
Figure 13. Raised floor requirements
Chapter 4. Physical installation site requirements
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