Figure 2-1
X6800 system architecture
2.2 Heat Dissipation
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The system draws in air from the front of the chassis, delivers the cool air to the server
nodes, hard disks, processors, dual in-line memory modules (DIMMs), backplane, and
fan modules, and then discharges warm air through the rear of the chassis.
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Two PSUs are installed in each side of the server chassis. Separated ventilation channels
are reserved to deliver the return air from the PSU fans for cooling.
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The system fans implement cooling of the management boards and I/O boards on the fan
modules.
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The high-pressure counter-rotating fans offer 10% higher air volume than common fans.
The refined air channels implement concentrated cooling of heat-sensitive devices. The
optimal distribution of temperature sensors covers all areas of high heat concentration
(server hotspots), facilitating accurate fan speed adjustment. The cellular design on the
panel offers a porosity of 66%, which is 10% higher than that of square holes. The fans
HUAWEI X6800 Server
Technical White Paper
2 System Design
Issue 02 (2019-03-13)
Copyright © Huawei Technologies Co., Ltd.
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