HUAWEI MU739 HSPA+ LGA Module
Hardware Guide
Electrical and Reliability Features
Issue 01 (2011-08-24)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
55
Description Test Value
Units
PCL
Configuration
155
2 Up/1 Down
230
4 Up/1 Down
In idle mode, the module is registered to the network, USB bus is active, and no voice or
data call connection is ongoing.
The above values are the average of some test samples.
5.6 Reliability Features
Table 5-13 lists the test conditions and results of the mechanical reliability of the
MU739 module.
Table 5-13
Test conditions and results of the mechanical reliability of the MU739 module
Item
Test Condition
Standard
Low-temperature
storage
Temperature: –40ºC ± 2ºC
Test duration: 24 h
IEC60068
High-temperature
storage
Temperature: 85ºC ± 2ºC
Test duration: 24 h
IEC60068
Low-temperature
working
Temperature: - 30ºC ± 2ºC
Test duration: 24 h
IEC60068
High-temperature
working
Temperature: 75ºC ± 2ºC
Test duration: 24 h
IEC60068
Damp heat cycling
High temperature: 55ºC ± 2ºC
Low temperature: 25ºC ± 2ºC
Humidity: 95%
Repetition times: 4
Test duration: 12 h + 12 h
IEC60068
Temperature shock Low temperature: - 40ºC ± 2ºC
High temperature: 85ºC ± 2ºC
Temperature change interval: < 30s
Test duration: 15 min
Repetition times: 100
IEC60068
draft2
