HUAWEI ME906s LTE M.2 Module
Hardware Guide
Installation
Issue 05 (2019-03-25)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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7.3 Thermal Management
Because ME906s is very small, the dissipating heat is very important to it.
It has to take several means to ensure ME906s to meet the specification.
The methods described as follow:
The mounting screw is to hold the module in place, and connect the heat source
to the platform ground plane of the custom board.
About the custom board, it can afford larger and much more area of grounding
layers to enhance cooling of the PCB and ensure that the heat spreads evenly in
the PCB.
The stand-off provides a thermal ground path. The design requirements for
thermal are a material with a minimum conductivity of 50 watts per meter Kelvin
and surface area of 22 Sq mm.
The customer can add a heat sink on the model top surface, and this method
can bring out much heat source of the module.
7.4 Antenna Plug
Figure 7-2
Mating the plug
1. Align the mating tool or the mating end of the tool over the plug end of the cable
assembly.
2. Firmly place the tool over the plug until it is secured in the tool.
3. Place the plug cable assembly (held in the tool) over the corresponding receptacle.
4. Assure that the plug and receptacle are aligned press-down perpendicular to the
mounting surface until both connectors are fully mated.
5. Remove the mating tool by pulling it up carefully.
