MF877-00 Page 2
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
PH1
Screwdriver
TT25
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use TT25 screwdriver to remove 4 screws on solar shield.
2. Use TT25 screwdriver to remove 6 screws of upper and lower cover.
3. Pull out 4 antennas from connectors.
4. Use PH1 screwdriver to remove five screws on antenna board.
5. Remove 9 screws on PCBA using Ph1 screwdriver
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
