MF877-00 Page 5 Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
MF877-01
3.1.5
3.1.6
Page 1: ...ed within the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 1 Batteries All types including standard alkaline and lithium coin or button style batteries 1 Mercury containing components For example mercury in lam...
Page 2: ...1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 1 Use a P1 Phillips Screw Driver to remove Fan finger screw and remove PSU and PSU blank bracket on chassis see 3 1 1 2 Use a P1 Phillips Screw Driver to remove cover and chassis screws see 3 1 2 3 Remove flat cable and fan cable and plastic front bezel see 3 1 3 4 Use a P1 Phi...
Page 3: ...MF877 00 Page 3 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 3 1 1 3 1 2 ...
Page 4: ...MF877 00 Page 4 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 3 1 3 3 1 4 ...
Page 5: ...MF877 00 Page 5 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 3 1 5 3 1 6 ...
Page 6: ...MF877 00 Page 6 Template Revision C 30 July 2018 Copyright 2018 Hewlett Packard Enterprise Development LP HPE instructions for this template are available at MF877 01 3 1 7 ...
