MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Phillips Screw Driver
P1,P2
Description #2 Flat Screw Driver
any
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Use a
P1 Phillips Screw Driver to remove Fan finger screw and remove PSU and PSU blank bracket on chassis. (see 3.1.1)
2.
Use a
P1 Phillips Screw Driver to remove cover and chassis screws .(see 3.1.2)
3. Remove flat cable and fan cable and plastic front bezel.
(see 3.1.3)
4. Use a
P1 Phillips Screw Driver to remove wind baffles on Main board .(see 3.1.4)
5. Use a
P1 and P2 Phillips Screw Driver to remove screws of LED board and main board and FAN board.(see 3.1.5)
6. Use a
P1 Phillips Screw Driver to remove MAC heatink and remove VRM modules / bettery on the main board.(see 3.1.6)
7. Use a flat screw driver to remove thermal pad and USB gasket on the chassis.
(see 3.1.7)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).