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EL-MF877-00                                                                                                Page  3 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

22.

 

Tore off the thermal pad of the metal frame. 

23.

 

Loosened 18 screws of the metal frame. 

24.

 

Removed the metal frame. 

25.

 

Separated the PCB assembly and plastic frame by removing cable. 

26.

 

Tore off the tape of LCD. 

27.

 

Removed the plastic frame of the panel. 

28.

 

Separated the touch panel and LCD.   

29.

 

Removed the FPC of the touch panel. 

30.

 

Removed the latch of the base by loosening 4 screws 

31.

 

Removed the bracket of base by loosening 4 screws. 

32.

 

Separated the metal and plasitc frame of the base- bracket.   

33.

 

Removed the plastic component of the joint part by loosening 2 screws. 

34.

 

Removed the tip pad by loosening 4 screws. 

35.

 

Opened the bottom cover by loosening 1 screw. 

36.

 

Tore off the thermal pad of the base. 

37.

 

Removed the side cover of the base. 

38.

 

Separated the base and stander by loosening 10 screws. 

39.

 

Pried open the plastic case of the joint parts. 

40.

 

Completed disassembly. 

3.2 Optional Graphic.  If the disassembly process is complex, insert a graphic illustration below to identify the items 
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Summary of Contents for RP9 G1 9115

Page 1: ...cable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 1 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries 1 Li Ion batteries Include all Li Ion batteries if more than one is provided with the product such as a detachable notebook key...

Page 2: ...2 55 3 00kgf cm 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure 1 Removed the base by loosening the latch 2 Tore off the label of the case 3 Pried open the case 4 Removed the plastic frame 5 Removed the metal sheet and tape of the...

Page 3: ...ws 31 Removed the bracket of base by loosening 4 screws 32 Separated the metal and plasitc frame of the base bracket 33 Removed the plastic component of the joint part by loosening 2 screws 34 Removed the tip pad by loosening 4 screws 35 Opened the bottom cover by loosening 1 screw 36 Tore off the thermal pad of the base 37 Removed the side cover of the base 38 Separated the base and stander by lo...

Page 4: ...EL MF877 00 Page 4 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 ...

Page 5: ...EL MF877 00 Page 5 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 ...

Page 6: ...EL MF877 00 Page 6 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 ...

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