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EL-MF877-00                                                                                                Page  2 
Template Revision C  

Last revalidation date 09-May-2018 

                 

 

 

 

 

  

HPI instructions for this template are available at 

EL-MF877-01

  

Item Description 

Notes 

Quantity of 
items 
included in 
product

 

Components and parts containing toner and ink, 
including liquids, semi-liquids (gel/paste) and toner 

Include the cartridges, print heads, tubes, vent 
chambers, and service stations.             

Components and waste containing asbestos 

            

Components, parts and materials containing refractory 
ceramic fibers 

            

Components, parts and materials containing 
radioactive substances 

            

2.0 Tools Required

 

List the type and size of the tools that would typically be used to disassemble the product to a point where components and 
materials requiring selective treatment can be removed. 

Tool Description 

Tool Size (if 
applicable) 

Philips Screwdriver 

T15 2.55-
3.00kgf.cm

 

Slotted Screwdriver 

2# 2.55-
3.00kgf.cm

 

           

           

           

           

           

           

3.0 Product Disassembly Process

 

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment 
including the required steps to remove the external enclosure:  

1.

 

Removed the base by loosening the latch. 

2.

 

Tore off the label of the case. 

3.

 

Pried open the case.   

4.

 

Removed the plastic frame. 

5.

 

Removed the metal sheet and tape of the plastic frame. 

6.

 

 Loosened 10 screws of the case. 

7.

 

 Removed the plastic case. 

8.

 

Removed the metal parts of the case. 

9.

 

Removed the metal frame. 

10.

 

Removed the metal frame by loosening 5 screws. 

11.

 

Removed the fan by loosening 3 screws. 

12.

 

Removed the metal frame for HDD by loosening 2 screws. 

13.

 

Removed the plastic parts of the metal frame by loosening 4 screws.   

14.

 

Removed the button cell. 

15.

 

Removed the side of PCB assembly by loosening 3 screws. 

16.

 

Removed the cable of the PCB assembly.   

17.

 

Removed the speaker. 

18.

 

Removed the antenna by loosened 2 screws. 

19.

 

Tore off sticker of the metal frame. 

20.

 

Loosened 9 screws of the PCB assembly. 

21.

 

Removed the PCB assembly.   

Summary of Contents for RP9 G1 9115

Page 1: ...cable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cm 1 Batteries excluding Li Ion batteries All types including standard alkaline coin or button style batteries 1 Li Ion batteries Include all Li Ion batteries if more than one is provided with the product such as a detachable notebook key...

Page 2: ...2 55 3 00kgf cm 3 0 Product Disassembly Process 3 1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure 1 Removed the base by loosening the latch 2 Tore off the label of the case 3 Pried open the case 4 Removed the plastic frame 5 Removed the metal sheet and tape of the...

Page 3: ...ws 31 Removed the bracket of base by loosening 4 screws 32 Separated the metal and plasitc frame of the base bracket 33 Removed the plastic component of the joint part by loosening 2 screws 34 Removed the tip pad by loosening 4 screws 35 Opened the bottom cover by loosening 1 screw 36 Tore off the thermal pad of the base 37 Removed the side cover of the base 38 Separated the base and stander by lo...

Page 4: ...EL MF877 00 Page 4 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 ...

Page 5: ...EL MF877 00 Page 5 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 ...

Page 6: ...EL MF877 00 Page 6 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 ...

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