EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
T-15
Micro shear
YN-3
Screw driver
PH2
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel. (see Figure 1-2)
2. Remove front bezel. (see Figure 3)
3. Disconnect cooler cable then remove the cooler from board. (see Figure4-5)
4. Remove the HDD (see Figure 6-8)
5. Remove the Slim ODD (see Figure 9-10)
6. Unplug all cable conn. from PCA. (see Figure 11)
7. Remove the PCA(see Figure 12-13)
8. Remove the DIMM. (see Figure 14)
9. Remove the CPU. (see Figure 15-16)
10. Remove the Battery. (see Figure 17)
11. Remove the FIO module from chassis. (see Figure 18-19)
12. Remove the PWR_LED switch cable from chassis. (see Figure 20-21)
13. Remove the SD card reader from chassis. (see Figure 22-23)
14. Remove the speaker from chassis. (see Figure 24-25)
15. Remove Sys fan from chassis. (see Figure 26-27)
16. Remove the PSU from chassis. (see Figure 28-29)
17. Remove the PSU chassis and remove the PSU board. (see Figure 30-39)
18. Remove the Electrolytic Capacitors from PSU board. (see Figure 40-54)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
