EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Star screwdriver
OD 3.3mm
Cross screwdrive
OD 3.0mm
Cross screwdrive
OD 6.0mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove side panel
2. Remove front bezel
3. Unplug ODD & HDD cables
4. Remove drive cage
5. Remove FIO cage
6. Remove ODD & HDD
7. Remove all cables
8. Remove fan duct
9. Remove cooler
10. Remove CPU
11. Remove Memory
12. Remove WLAN module
13. Remove all PCIEXP cards
14. Remove card reader
15. Remove antenna cable
16. Remove MB and battery
17. Remove PSU
18. Remove speaker
