EL-MF877-00
Page
2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Crisscross screw driver x1
Description #2 Clipper x1
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Loose the thumb screw of side cover.
2.
Remove the side cover.
3.
Loose the 3 hooks of front panel, then remove front panel.
4.
Use clipper to take clip tie off.
5.
Rrelease All cable on MB, HDD, ODD and cards.
6.
Take off the bluejay.
7.
Loose the PCI slot screws, then take all add on cards off.
8.
Push the grip and take HDD module off.
9.
Separete HDD and holder.
10. Push the latch to take off Mini PMD bay.
11. Push the latch to take off card reader.
12. Use screwdriver to loose 2pcs screws, then take the PMD bay off.
13. Push the latch to take off ODD.
14. Remove system fan and top fan.
15. Remove the front IO module.
16. Remove the bluetooth module.
17. Remove memory from MB.
18. Remove heat sink and CPU.
19. Remove the CPU.
20. Remove MB.
21. Remove the rear IO shielding by using screwdriver.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
