4–58
Maintenance and Service Guide
Removal and replacement procedures
✎
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly and the system
board each time the fan/heat sink assembly is removed:
■
Thermal paste is used on the processor
1
and the heat sink section
2
that services it.
■
Thermal pads are used on the Northbridge chip
3
and the heat sink section
4
that services it.
■
Thermal pads are used on the graphics subsystem memory module
5
and the heat sink section
6
that
services it.
■
Thermal pads are used on the other system board components
7
and heat sink sections
8
that service them.
Replacement thermal material is included with all system board, fan/heat sink assembly, and processor spare
part kits.
✎
Steps 4 and 5 apply to computer models equipped with graphics subsystems with UMA memory. See steps 2
and 3 for instructions on removing the fan/heat sink assembly on computer models equipped with graphics
subsystems with discrete memory.
4. Loosen the four captive Phillips PM2.0×7.0 screws
1
that secure the fan/heat sink assembly to the
system board.
5. Remove the fan/heat sink assembly
2
.
Summary of Contents for Pavilion dv3-2300 - Entertainment Notebook PC
Page 2: ......
Page 8: ...viii Maintenance and Service Guide ...
Page 24: ...2 10 Maintenance and Service Guide External component identification ...
Page 26: ...3 2 Maintenance and Service Guide Illustrated parts catalog Computer major components ...
Page 62: ...3 38 Maintenance and Service Guide Illustrated parts catalog ...
Page 124: ...4 62 Maintenance and Service Guide Removal and replacement procedures ...
