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Product End-Of-Life Disassembly Instructions

HP OMEN 15, Product End-Of-Life Disassembly Instructions

The HP OMEN 15 comes with a comprehensive Maintenance And Service Manual, ensuring a hassle-free user experience. This detailed manual provides step-by-step instructions for maintenance and servicing tasks. Download your free copy from our website manualshive.com, and maximize the performance of your HP OMEN 15 without any worries.

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EL-MF877-00 Page 5
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at

EL-MF877-01

Step6: Remove MB and SD board/PCB

Step7:

Remove LCD assy

Step8: Remove Speakers& DC IN cable

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Summary of Contents for OMEN 15

Page 1: ...ing selective treatment 1 2 Enter the quantity of items contained within the product which require selective treatment in the right column as applicable Item Description Notes Quantity of items included in product Printed Circuit Boards PCB or Printed Circuit Assemblies PCA With a surface greater than 10 sq cmMB 1 Batteries excluding Li Ion batteries All types including standard alkaline coin or b...

Page 2: ...ibers Components parts and materials containing radioactive substances 2 0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed Tool Description Tool Size if applicable Description 1 Description 2 Description 3 Description 4 Description 5 3 0 Product Disassem...

Page 3: ...lable at EL MF877 01 3 2 Optional Graphic If the disassembly process is complex insert a graphic illustration below to identify the items contained in the product that require selective treatment with descriptions and arrows identifying locations Disassembly process Step1 Remove log low assy Step2 Remove battery pack ...

Page 4: ... MF877 00 Page 4 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step3 Remove HDD assy Step4 Remove NGFF Step5 Remove Thermal module ...

Page 5: ...Page 5 Template Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step6 Remove MB and SD board PCB Step7 Remove LCD assy Step8 Remove Speakers DC IN cable ...

Page 6: ...plate Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step9 Remove Power Board and Thermal Sensor Board Step10 Remove bezel hinge cap assy Step11 Remove LCD panel ...

Page 7: ...mplate Revision C Last revalidation date 09 May 2018 HPI instructions for this template are available at EL MF877 01 Step12 Remove hinge r hinge l assy Step13 Remove LCD support bracket Step14 Remove EDP cable antenna cable ...

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