EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
200mm
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
200mm
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws and remove the COVER_SERVICE to remove the rear cover.
2. Disconnect the connector.
3. Remove the tapes and all the screws to remove the main board and power board.
4. Remove the screws to remove the main board.
5. Disconnect the LVDS cable to remove tha panel.
6. Unscrew the screws to remove the speaker and IR board.
7. Unscrew the screws to remove the key board.
8. Dismantel Key board into PCB board and Key cover
9. Dismantel IR board into PCB board and IR lens
10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
