EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
No
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
xxxx
Hexagonal wrench
xxxx
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Put the MNT on the clean vinyl
2. Remove stand base from product
3. Remove the screw from the product
4. Disassemble cabinet and back cover
5. Disassemble the back cover
6. Disassemble the metal support
7. Disassemble the side braket,LVDS, Lamp Wire and Control Wire
8. Remove the pannel
9. Remove the screw and remove control pcb
10. main pcb and LIPS
11. Control PCB
12. LCD Pannel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Fig.1 Put the MNT on the clean vinyl
