HP HCPL-2400, Technical Data Manual

Page: 6 / 14

1-305
Absolute Maximum Ratings
(No derating required up to 70
°
C)
Parameter Symbol Minimum Maximum Units Note
Storage Temperature T
S
-55 125
°
C
Operating Temperature T
A
-40 85
°
C
Average Forward Input Current I
F(AVG)
10 mA
Peak Forward Input Current I
FPK
20 mA 12
Reverse Input Voltage V
R
2 V
Three State Enable Voltage V
E
-0.5 10 V
(HCPL-2400 Only)
Supply Voltage V
CC
0 7 V
Average Output Collector Current I
O
-25 25 mA
Output Collector Voltage V
O
-0.5 10 V
Output Voltage V
O
-0.5 18 V
Output Collector Power Dissipation P
O
40 mW
(Each Channel)
Total Package Power Dissipation P
T
350 mW
(Each Channel)
Lead Solder Temperature 260
°
C for 10 sec., 1.6 mm below seating plane
(for Through Hole Devices)
Reflow Temperature Profile See Package Outline Drawings section
(Option #300)
Recommended Operating Conditions
Parameter Symbol Minimum Maximum Units
Power Supply Voltage V
CC
4.75 5.25 V
Forward Input Current (ON) I
F(ON)
4 8 mA
Forward Input Voltage (OFF) V
F(OFF)
0.8 V
Fan Out N 5 TTL Loads
Enable Voltage (Low) V
EL
0 0.8 V
HCPL-2400 Only)
Enable Voltage (High) V
EH
2 V
CC
V
HCPL-2400 Only)
Operating Temperature T
A
0 70
°
C