EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdiver
TORX T8
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Removed Base Top Cover
2. Removed Base Front Cover
3. Removed Power Switch Board, Sensor Board
4. Remove 4 screws then disassembly the LID (LCD chassis)
5. Removed Fan Module
6. Removed Heat Sink
7. Removed Stand Arm Base, MB Protect Cover
8. Removed Side I/O Top Shielding
9. Remove SSHD
10. Removed Speaker module
11. Removed Wireless Card, Ram, CPU
12. Removed RTC battery
13. Removed Motherboard, Bottom Base Cover
14. Removed Stand Rear Cover, Stand Front Cover
15. Removed Stand Arm
16. Removed Rear Cover
17. Removed Hinge Stand, OSD board
18. Removed Scalar Shielding, Scalar Board, Scalar Bracket Bottom
19. Removed Camera Box, Camera Transfer Board
20. Removed Camera Module, Camera Bracket , DMIC Board, RGB Camera Box Cable
21. Removed Camera Holder, LCD Frame
22. Removed LCD Chin, LCD Chin Bracket, LCD Panel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Removed Base Top Cover
