EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the base
2. Remove the hinge
3. Remove the REAR_COVER.
4. Separate the MAINFRAME and PANEL
5. Remove the key board & Bezel & panel.
6. Remove the MAIN BOARD and POWER BOARD
7.
8.
9.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Summary of Contents for B201
Page 5: ...3 The panel The panel ...
