MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx screwdriver
TT10
Static electric tweezers
NA
Torx screwdriver
DEC
Torx screwdriver
PH1
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the two screws on the bracket at the position shown in the figure with the torque force equipment (Type:
DEC).
2. Put the unit onto the fixture and remove the four screws from the die cast with torque force equipment
(Type:TT10).
3. Remove the top cover.
4.
Use electrostatic tweezers to remove the antenna cable from the PCBA board. Remove the four screws with torque
force equipment (Type:PH1).
5.
Remove the antenna plate from the PCBA board. Please note that you should handle the edge of the antenna plate to
remove, don’t touch the antenna module and terminal.
6.
Remove the three screws from PCBA board with torque force equipment (Type:PH1).
7. Remove the PCBA board from the die cast.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
