EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available a2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove AP from accessories 7.
2. Remove the antenna 3 from base 1.
3. Unscrew the screws on cover 2, and then remove cover 2.
4. Remove all of the inner cables.
5. Unscrew the screws on press plate 4, and then remove press plate 4.
6. Remove the radio card 5 from base 1.
7. Unscrew the screws on PCB 6, and then remove PCB 6.
8. Remove thermal conductive pad 1-5 from base 1-1.
9. Unscrew the screws on heat sink 1-2, and then remove heat sink 1-2.
10. Remove film 1-3 from base 1-1.
11. Remove shielding finger 1-4 from base 1-1.
12. Remove wire saddle 1-6 from base 1-1.
13. Remove all of the labels.
14. Remove brand 2-1 from cover 2-2.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1 Treatments to the product
