EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Press release button to remove the base by hand.
2. Press release button to remove the stand by hand.
3. Use the screwdriver to remove screws.
4. Separate the REAR_COVER by scraper.
5. Remove keyboard by hand.
6. Tear out tapes, and remove scres by hexagonal screw driver.
7. Disconnect the connector to remove wireness by hand.
8. Separate the MAINFRAME and PANEL by hand.
9. Remove the key board & Bezel & panel by hand.
10. Remove the screws by screwdriver.
11. Separate MAIN BOARD and POWER BOARD by hand.
12.
13.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Pls. refer the attached:
Summary of Contents for 20kd
Page 6: ...4 The Power Board Use the Scraper to remove the Capacitance ...
Page 7: ...5 ...
Page 8: ...6 The panel Remove the bezel by hand ...
Page 9: ...7 ...
