HiSilicon Hi3516D V300, User Manual

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Hi3516D V300 Demo Board
User Guide
3 Operation Guide
Issue 00B01 (2018-09-04)
HiSilicon Proprietary and Confidential
Copyright © HiSilicon Technologies Co., Ltd.
6
Boot Mode Value Resistor
Connection Remarks
01 SW1.4 is set to 0,
while SW1.3 is set to
1. Boot from the eMMC.
10 SW1.4 is set to 1,
while SW1.3 is set to
0.  Fastboot
 Update SPI flash
(default)
11 SW1.4 and SW1.3
are set to 1.

Fastboot

Update eMMC (default)
[SFC_DEVICE_MODE:
SFC_BOOT_MODE] 00 SW1.1 is set to 0,
R188 is removed,
and R367 is soldered. SPI NOR flash. The default
addressing mode is 3-byte
mode.
01 SW1.1 is set to 0,
R367 is removed,
and R188 is soldered. SPI NOR flash. The default
addressing mode is 4-byte
mode.
10 SW1.1 is set to 1,
R188 is removed,
and R367 is soldered. SPI NAND flash. The
default addressing mode is
1-wire boot mode.
11 SW1.1 is set to 1,
R367 is removed,
and R188 is soldered. SPI NAND flash. The
default addressing mode is
4-wire boot mode.
UPDATE_MODE 0 S3 key is pressed
down. Enable update from SDIO0
or USB.
1 S3 key is not pressed
down. Disable UPDATE_MODE
(default).
Table 3-2 JTAG settings
Boot Mode Value Instructions Remarks
JTAG/SPI1/I2S 0 SW3.1 is set to 0. JTAG
1 SW3.1 is set to 1. SPI1/I2S (SPI1 and I2S are
soldered by using resistors.)
3.3 DIP Switch Usage
As shown in Figure 3-1 , the pin1 side of the DIP switch is 1 while the other side is 0 .
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