HiSilicon Hi3516D V300, User Manual

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Hi3516D V300 Demo Board
User Guide
3 Operation Guide
Issue 00B01 (2018-09-04)
HiSilicon Proprietary and Confidential
Copyright © HiSilicon Technologies Co., Ltd.
5
3
Operation Guide
3.1 Precautions
The Hi3516D V300 demo board applies to the laboratory or engineering development
environment. Take the following precautions before performing operations:
CAUTION
Never perform the hot-swap operation on the board in any case.

Take antistatic measures before unpacking or installing the board to prevent the board
hardware from being damaged by the electrostatic discharge (ESD).

Hold the board on the edge and do not touch the exposed metal on the board. Otherwise,
the board components may be damaged by the ESD.

Place the Hi3516D V300 demo board on a dry workstation and keep it away from heat
sources, electromagnetic interference sources, radiant sources, and electromagnetic
susceptibility equipment (such as the medical equipment).

Familiarize yourself with the layout of the Hi3516D V300 demo board. See Figure 2-1 .
Ensure that you can identify the components such as the switches, connectors, and
indicators and know their positions.
3.2 Board Settings
The operating mode of the Hi3516D V300 is selected by using the keys and selecting the
resistors to be welded on the Hi3516D V300 demo board. See
Table 3-1 .
Table 3-1 Board settings in various boot modes
Boot Mode Value Resistor
Connection Remarks
BOOT_SEL[1:0] 00 SW1.4 and SW1.3
are set to 0. Boot from the SPI flash.
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