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HID Lumidigm M Series, Mechanical Integration Manual

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HID Lumidigm M Series Mechanical Integration Manual Download Page 17

 

 

 

 
 

Lumidigm M-Series M3xx Modules Mechanical Integration Guide, PLT-02217, Rev. A.0 

Page 17 of 28  

December 2014  

3.5.1

 

Connectivity 

Detail for M31x ECU connectivity is provided in Figure 14 and in the chart, both below: 

 

 

Figure 14: M31x ECU connector positions 

Connector Position MH  

Red 

MH2  +5V   (USB) 

White  MH3  D- 

(USB) 

Green  MH4  D+ 

(USB) 

Black  MH5  GND  (USB) 

MH7   GPO #1 through 430 ohm resistor 
MH8   5VDC 
MH9   GPO #2 through 430 ohm resistor 

Note: Customer provides cables or wires. 
Note: Cable shield ground should be connected to enclosure ground. The enclosure ground 

must be close to the M31x ECU to insure signal integrity.  

 

 

Summary of Contents for Lumidigm M Series

Page 1: ...Lumidigm M Series M3xx Modules Mechanical Integration Guide PLT 02217 Rev A 0 December 2014 hidglobal com Lumidigm...

Page 2: ...Head Mounting Summary 13 3 4 ECU M30x 14 3 4 1 Connectivity 15 3 5 ECU M31x 16 3 5 1 Connectivity 17 3 5 2 GPIO Controls 18 3 6 ECU to Sensor Connection 19 4 Environmental Considerations 20 4 1 Summa...

Page 3: ...f HID Global Corporation or its licensors in the U S and other countries Lumidigm is a registered trademark of Lumidigm Inc Revision History Date Description Version 12 16 14 First release as part of...

Page 4: ...cable Together these three parts constitute the Lumidigm M Series modules The M Series modules are designed to be incorporated into products where a reliable biometric with Real World Performance is r...

Page 5: ...practical in the platen area such that the fingerprint core is in the center of the platen The enclosure design and placement of the enclosure should allow the fingers to be as flat as possible when...

Page 6: ...time guiding user finger placement towards the center of the sensor platen An example is shown in Figure 2 Because performance is improved when users correctly place the finger flat on the platen the...

Page 7: ...n area And finally the rectangular sealing surface aligns to the M3xx sensor head sealing area If an IP65 rated enclosure is required an additional gasket would be added between the M3xx sensor head a...

Page 8: ...3 below the correct user approach direction is from left to right with the blue light directed towards the right away from the user Figure 3 Presence detection illumination pattern The blue PD LED is...

Page 9: ...31x product lines use the same sensor head Figure 6 shows a cutaway view of the M3xx sensor head showing the platen area enclosure and an assembly consisting of a PCB with the imager and LEDs and a pl...

Page 10: ...the M3xx sensor head are shown in Figure 7 and a complete 3D CAD model of both the M3xx sensor head as well as the M30x and M31x ECUs are available from Lumidigm to support design activities Figure 7...

Page 11: ...stomer mounting The arrangement in Figure 8 consists of 1 a clip attached to the M3xx sensor head mating with its exterior features and 2 screws securing this clip to an example customer enclosure whe...

Page 12: ...present Note M3xx modules do not ship with a mounting clip 3D CAD models and samples of the clip shown are available from HID Global Figure 9 Example M3xx sensor head retaining clip Once exterior fea...

Page 13: ...e of a positive stop design using the mounting ring shown in Figure 9 Figure 10 Example mounting detail 3 3 Sensor Head Mounting Summary The features that capture and hold the M3xx sensor head should...

Page 14: ...f the M30x The ECU is a printed circuit board PCB with components on both sides Wiring for power and I O interfaces are available at connectors perpendicular to the PCB Allowances for wiring need to b...

Page 15: ...Mating Hirose connector housing p n is DF13 7S 1 25C with 26 30AWG crimp terminal p n DF13 2630SCF J3 1 GND J3 2 N C J3 3 N C J3 4 Program Flag 10 J3 5 Program Flag 11 J3 6 Program Flag 12 J3 7 Progra...

Page 16: ...tation to the sensor head to allow for proper installation and routing of the flex cable that connects these two components of the M31x The ECU is a printed circuit board PCB with components on both s...

Page 17: ...both below Figure 14 M31x ECU connector positions Connector Position MH Red MH2 5V USB White MH3 D USB Green MH4 D USB Black MH5 GND USB MH7 GPO 1 through 430 ohm resistor MH8 5VDC MH9 GPO 2 through...

Page 18: ...and 5V current will flow Note that the forward voltage drop of a red LED 0 7V is not adequate for the output to turn the LED fully off in the HI state an additional diode drop in series is recommende...

Page 19: ...ble to rotate with respect to the connector In this event power events can disrupt the calibration data or ultimately cause a hardware failure in the sensor head We recommend using hot glue to secure...

Page 20: ...In this design guide we assume that M3xx specifications are representative of the other enclosure components 4 1 Summary of Environmental Considerations The entire enclosure should be sealed from liqu...

Page 21: ...rd for placements above waist height The shallow depression and the downward angle also facilitate drainage when the enclosure is exposed to precipitation or cleaned with a water spray Figure 17 Examp...

Page 22: ...a Background light the combination of the enclosure design and the placement of the enclosure in the environment must prevent exposing the platen to direct sunlight The M3xx can tolerate direct lighti...

Page 23: ...icient nature of modern electronic systems the amount of power dissipation will only provide 3 C to 6 C rise in internal temperature relative to external temperature If the minimum external operating...

Page 24: ...water ingress test This is a self certification using a documented test procedure that can be performed either by the manufacturer or a lab hired by the manufacturer The M3xx sensor head is an optical...

Page 25: ...nter weighting exposure filtering IR out and masking off the non finger areas sensitivity has been minimized Direct sunlight is sunlight that is directly overhead or near perpendicular to the platen s...

Page 26: ...temperature Condensation can manifest itself in two ways First the enclosure walls can cool to the dew point and cause spot condensation at the cooler contact points Secondly as the air mass temperatu...

Page 27: ...et to 10 C If the enclosure design approach uses a vent or is vented into a larger air mass such as a building interior the desiccant will be rendered ineffective and a different control strategy woul...

Page 28: ...hidglobal com...

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