MF877-00 Page 2
Template Revision A
HPE instructions for this template are available at
Item Description
Notes
Quantity
of items
included
in product
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on part 1 ,and then remove part 1;
2. Unscrew the screws under the guiding set 2 ,and then remove guiding set 2;
3. Unscrew the screws on part 3 ,and then remove part 3;
4. Remove the heatsink 4 from pcb 7;
5. Remove the heatsink 5 from pcb 7;
6. Unscrew the screws on heat sink 6,and then remove heat sink 6;
7. Unscrew the screws on pcb 7,and then remove pcb 7;
8. Remove shielding finger 8 from panel 10;
9. Remove film 9 from panel 10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure Treatments to the product
