AN8814SB
■
Electrical Characteristics at T
a
=
25
°
C (continued)
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Thermal protection circuit
Operating temperature
T
THD
180
°
C
equilibrium value
Operating temperature
∆
T
THD
45
°
C
hysteresis width
•
Design reference data
Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed.
■
Usage Notes
1. Avoid the short-circuits between output and V
CC
, and between output pin and GND.
Otherwise, the IC is likely to break down or emit smoke.
2. An appropriate prior study should be done for use of dip soldering.
■
Application Notes
•
P
D
T
a
curves of HSOP042-P-0400
P
D
T
a
0.000
0
25
50
75
100
125
150
2.500
1.500
1.000
2.240
2.000
1.042
0.500
Ambient temperature T
a
(
°
C)
Po
wer dissipation
P
D
(W)
Mounted on standard board
(glass epoxy:
75 mm
×
75 mm
×
t1.6 mm)
R
th(j-a)
=
55.8
°
C/W
Independent IC
without a heat sink
R
th(j-a)
=
119.9
°
C/W
HD750
30
Summary of Contents for HD750
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Page 55: ...HD750 MAINBOARD 55...
Page 56: ...HD750 CONTROL PANEL 56...
Page 57: ...HD750 57...
Page 58: ...HD750 REMOTE UNIT 58...
Page 59: ...HD750 59...
Page 60: ...DISPLAY PANEL PCB POWER SWITCH PCB HEADPHONES PCB HD750 60...
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