HSBT3031-08 module_datasheet
Version2.0– Jun. 15
th
HANSONG ( NANJING) TECHNOLOGY CO.,LTD
25
related to the current drawn by the
Bypass LDO
c
a To achieve specified accuracy, follow layout recommendations in QCC3031 QFN
Hardware Design Guide (80-CG380-1).
b Resistor value should be chosen such that the maximum fast charge current
corresponds to 100 mV of voltage drop.
C Varies linearly with the total current (in external) drawn by the Bypass LDO;
worst case inaccuracy is +3% corresponding to 50 mA Bypass LDO output.
10.4 10
‑
bit auxiliary ADC
Min
Typ
Max
Unit
Resolution
-
-
10
Bits
VDD_AUX_ADC
a
1.746
1.8
1.854
V
Functional input voltage range
b
0
-
VDD_AUX_
ADC
V
Accuracy (Guaranteed
monotonic)
c
INL
-3
-
3
LSB
DNL
-1
-
2
LSB
Offset
-1
-
1
LSB
Gain error
-1
-
1
%
Hardware conversion time
d
-
10
-
us
LED pad leakage
-1
-
1
uA
External pad capacitance for < 0.5 LSB error 0
100
-
nF
a Internal voltage reference.
b LSB size = VDD_AUX_ADC/1023.
c Accuracy guaranteed for input signal range: [4LSBs; Full scale - 4LSBs].
d Software may introduce additional delay.
10.5 Digital terminals
Min
Typ
Max
Unit
VDD_PADS supply
1.7
1.8
3.6
V
VIL input logic level low
-
-
0.22 x
VDD_PADS
V
VIH input logic level high
0.7 x
VDD_PADS
-
-
V
Drive current (configurable)
2, 4, 8, 12 4
-
mA
VOL output logic level low, at max rated
drive
-
-
0.22 x
VDD_PADS
V
VOH output logic level high, at max rated
drive
0.75 x
VDD_PADS
-
-
V